本设备主要用PCB板上面的电子元件插装脚焊接
APS460在线式选择性预热焊接机技术参数
APS460 Auto Preheat and Selective Soldering System
规格表specifications | 参数Parameter | |
外型尺寸Size | 2400L*1350W*1725H (mm) | |
机器框架及外罩 Machine frame and cover | 框架+冷板喷粉 Extruded sections frame + Door | |
作业高度Operating height | 900+25mm | |
重量Weight | Approx.1100KG | |
电源Power supply | 3相380V 50/60HZ | |
总功率Total power | 16KW | |
PCB规格 PCB parameter | ||
PCB尺寸 PCB size | Min:100(L)*50(W);Max:600(L)*460(W)(mm) | |
板面元件高度 Top component height | Max100mm | |
板底元件高度 Bottom component height | Max15mm | |
PCB重量 PCB Weight | Max5Kg | |
PCB工艺边 PCB Process Edge | >5mm | |
选点焊预热系统 Selective preheat system | ||
预热方式 Preheat mode | 远红外线方式 Far infrared ray | |
预热功率 Heater power | 1KW*9 Pcs | |
预热区域 Heater position | 底部加热 Bottom | |
控温方式 Temperature control mode | PID+SSR | |
温度设定范围 Temperature setting range | Max400OC | |
控温精度 Temperature accuracy | ±1OC | |
选择性焊接系统Selective Soldering System | ||
焊接移动方式 Welding movement mode | 锡炉于XYZ轴上移动 Soldering pot movement in XYZ axis | |
移动方式 Movement mode | 伺服马达+直线滑轨方式 Step motor + linear rail | |
无铅锡添加方式 Solder feeding mode | 手动(可选项:自动) Manual( Option: auto) | |
无铅锡容量Solder capacity | 16KG | |
熔锡时间Solder melting time | 20min | |
功率 Solder power | 3.3KW | |
焊接喷嘴规格 Solder nozzle size | 标配D8mm,其余规格可选配 Standard D8mm, other sizes is option | |
焊接节拍时间 Solder cycle time | 3秒/点 3 Sec/ soldered dot | |
控温方式 Temperature control mode | PID+SSR | |
温度设定范围 Temperature setting range | Max400OC | |
控温精度 Temperature accuracy | ±1OC | |
锡波高度Waver height | Max 5mm | |
焊锡精度Welding precision | 0.1mm | |
锡渣产生量 Solder dross | 0.2Kg/8H(无氮气保护);0.01Kg/8H(氮气保护) 0.2Kg/8H(Not N2 protection);0.01Kg/8H( N2 protection) | |
运输系统 Conveyor system | ||
传动方式 Conveyor method | 采用导轨+不锈钢滚轮方式 Adopt rail + stainless roller | |
PCB定位方式 PCB fix method | 采用气缸+压条定位PCB板边 Adopt cylinder + depression bar to fix PCB edge | |
PCB定位气缸数量 QTY of fitting PCB | 2*2个 2*2 PCS | |
止档器数量 Stopper quantity | 1*2个 1*2 PCS | |
氮气保护系统 N2 protection system | ||
氮气保护方式 N2 protection mode | 喷嘴及熔锡液面 Nozzle and solder pot | |
氮气消耗量 N2 consumption | 1.2M3/h | |
氮气流量控制 N2 flow control | 数显流量控制 Digital flow control | |
外部抽风系统Exhaust system | ||
顶罩式抽风 Top cover exhaust | 客户自配 Customer supply | |
抽风管数量 Exhaust quantity | 1个 1 PCS | |
排风量 Exhaust volume | 约5m³/h(由客户自配外接排风通道) About 5m³/h | |
控制系统Control system | ||
控制方式 Control mode | 触摸屏+PLC Touch screen + PLC | |
PCB制程参数 PCB Process parameter | 于触摸屏上设定、保存、调用 Setting, save , open in the touch screen | |
蜂鸣器 buzzer | 蜂鸣器提示作业完成 Prompt sound from the buzzer | |
焊接实时监控 Welding real-time monitoring | 摄像头+硬盘录像机+LED显示器 Camera+ Hard disk recorder + Led display | |
其它 Other | PCB产量计数功能、故障记录、报警记录可于触摸屏上调阅 PCB counting, message, alarm can be read in the touch screen | |
可选项Option | ||
PC控制系统 PC control system | ||
上预热系统 Top preheat system | ||
扫码枪Sweep gun |
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