Online selective wave soldering machine

  • model: SDS250-II
  • size: 1050L*885W*1250H (mm)
  • Working height: 900±20mm
  • weight: Approx.150kg
  • power supply: 1φ220V 50/60HZ
  • Total power: 200W
  • control method: Touch screen + PLC
  • PCB process parameters: Set, save, and call on the touch screen
  • buzzer: Buzzer prompts the job to be completed

  • Parameters
  • model: SDS250-II
  • size: 1050L*885W*1250H (mm)
  • Working height: 900±20mm
  • weight: Approx.150kg
  • power supply: 1φ220V 50/60HZ
  • Total power: 200W
  • control method: Touch screen + PLC
  • PCB process parameters: Set, save, and call on the touch screen
  • buzzer: Buzzer prompts the job to be completed

SDS250-II选择性焊接机技术参数

SDS250-II Selective Soldering System

规格表specifications

参数Parameter

外型尺寸Size

1050L*885W*1250H (mm)

机器框架及外罩

Machine frame and cover

型材框架+冷板喷粉

Extruded sections frame + Door

作业高度Operating height

900±20mm

重量Weight

Approx.350KG

电源Power supply

3φ380V  50/60HZ

总功率Total power

5.5KW

PCB规格 PCB parameter

PCB尺寸 PCB size

Max330L*250W);Min: 100L*50W(mm)

板面元件高度

Top component height

Max100mm

板底元件高度

Bottom component height

Max15mm

PCB重量 PCB Weight

Max3Kg

PCB工艺边 PCB Process Edge

3mm

选择性焊接系统Selective Soldering System

焊接移动方式

Welding movement mode

PCBXYZ轴上移动

PCB movement in XYZ axis

移动方式

Movement mode

步进马达+直线滑轨方式

Step motor + linear rail

无铅锡添加方式

Solder feeding mode

手动(可选项:自动)

Manual( Option: auto)

无铅锡容量Solder capacity

16KG

熔锡时间Solder melting time

20min

功率 Solder power

3KW

焊接喷嘴规格

Solder nozzle size

标配D8mm,其余规格可选配

Standard D8mm, other sizes is option

焊接节拍时间

Solder cycle time

3/

3 Sec/ soldered dot

控温方式

Temperature control mode

PID+SSR

温度设定范围

Temperature setting range

Max400OC

控温精度

Temperature accuracy

±1OC

锡波高度Waver height

Max 5mm

焊锡精度Welding precision

0.1mm

锡渣产生量

Solder dross

0.2Kg/8H(无氮气保护);0.01Kg/8H(氮气保护)

0.2Kg/8HNot N2 protection);0.01Kg/8H( N2 protection)

推板机构Push PCB System

推板方式

Push PCB mode

步进马达+直线模组

Step motor + linear rail model

推板位置设定

Position of PCB output

可于触摸屏上设定

Can be set in the touch screen

氮气保护系统 N2 protection system

氮气保护方式

N2 protection mode

喷嘴及熔锡液面

Nozzle and solder pot

氮气消耗量

N2 consumption

2M3/h

氮气流量控制

N2 flow control

数显流量控制

Digital flow control

外部抽风系统Exhaust system

顶罩式抽风

Top cover exhaust

客户自配

Customer supply

抽风管数量

Exhaust quantity

1

1 PCS

排风量

Exhaust volume

5m³/h(由客户自配外接排风通道)

About 5m³/h

其它Other

PCB送入方式

PCB entry mode

手动推入

Manual operation

控制系统Control system

控制方式

Control mode

触摸屏+PLC

Touch screen + PLC

PCB制程参数

PCB Process parameter

于触摸屏上设定、保存、调用

Setting, save , open in the touch screen

其它

Other

PCB产量计数功能、故障记录、报警记录可于触摸屏上调阅

PCB counting, message, alarm can be read in the touch screen

可选项Option

作业高度Operating height 750±20mm

焊接时锡炉于XYZ轴上移动,PCB固定 Soldering pot move in XYZ axes and PCB fixedly

 


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Contact: Mr. Dai

Mobile :13823354076

telephone:0769-82930051

Address: No. 5, Beiyi Lane, Yanqian Street, Yanwu Village, Dayingshan Town, Dongguan City

顺达成自动化科技有限公司

Sundarc automation technology.co.LTD

 

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